Method of manufacturing semiconductor device

Details Method of manufacturing semiconductor device Method of manufacturing semiconductor device

2007-12-11

2007-12-11

Dang, Trung (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C257SE21568, C257SE21600, C257SE21700

Reexamination Certificate

active

11354824

ABSTRACT:
It is an object of the present invention to provide a technology to manufacture a semiconductor sheet or a semiconductor chip with a high yield using a circuit having a thin film transistor. A manufacturing method for a semiconductor device comprises: attaching a flexible base material to an element layer x times (x is an integer number of 4 or more), wherein a thickness of a base material which is attached to the element layer (y+1)th (y is an integer number of 1 or more and less than x) time is the same or smaller than that of a base material which is attached to the element layer y-th (y is an integer number of 1 or more and less than x) time.

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