Method of manufacturing semiconductor device

Details Method of manufacturing semiconductor device Method of manufacturing semiconductor device

2006-10-03

2006-10-03

Tran, Mai-Huong (Department: 2818)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S033000, C438S050000, C438S052000

Reexamination Certificate

active

07115482

ABSTRACT:
Extremely thin chips laminated to a non-ultraviolet ray curing type adhesive tape are peeled from the tape without giving rise to cracks and chippings. In a center portion of a suction block used for peeling off a chip laminated to a dicing tape, three blocks which push the dicing tape upwardly are incorporated. With respect to these blocks, inside the first block having a largest diameter, there is a second block having a diameter smaller than the diameter of the first block. Further, inside the second block, there is a third block having the smallest diameter. To peel off a chip by pushing a back surface of the dicing tape with the blocks, first of all, the three blocks are simultaneously pushed upwardly by a certain amount and, thereafter, the intermediate block and the inner block are further pushed upward, and, finally, the inner block is further pushed upward.

REFERENCES:
patent: 5668033 (1997-09-01), Ohara et al.
patent: 2000-353710 (2000-12-01), None

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