Method of manufacturing semiconductor device

Etching a substrate: processes – Forming or treating article containing a liquid crystal...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437228, 216 41, 216 58, 216 76, C23F 100

Patent

active

054317738

ABSTRACT:
A method of manufacturing a semiconductor device, which comprises steps of providing a substrate, forming an oxide layer of a metal material, which includes a tantalum or an alloy mainly containing a tantalum on the substrate, placing the substrate into a first chamber, activating an etching gas which includes a fluorine containing gas and an oxygen containing gas, in a second chamber, introducing the activated etching gas into the second chamber, and etching the oxide layer by the introduced gas selectively against the substrate. A method of manufacturing a liquid crystal display device, which comprises steps of providing a substrate, forming an anodic oxide layer of a tantalum containing material on the substrate, forming an etching mask on the anodic oxide layer, placing the substrate into a first region, activating a mixture of fluorine and oxygen containing gas in a second region, apart from the first region, introducing the activated etching gas into the first region through a gas introducing portion, and etching the oxide layer on the substrate selectively against the substrate, by using the etching mask.

REFERENCES:
patent: 4158613 (1979-06-01), Sogo
patent: 4687544 (1987-08-01), Bersin
patent: 4711698 (1987-12-01), Douglas
patent: 4718976 (1988-01-01), Fujimura
patent: 4789645 (1988-12-01), Calviello et al.
patent: 4929059 (1990-05-01), Takahashi
patent: 5098860 (1992-03-01), Chakravorty et al.
D. E. Ibbotson et al., "Selective interhalogen etching of tantalum compounds and other semiconductor materials", Applied Physics Letters, vol. 46, No. 8, Apr. 15, 1985, New York.
JP 1283524, Suzuki Katsumi et al., "Liquid Crystal Display Device", Patent Abstracts of Japan, vol. 14, No. 59, Feb. 2, 1990.
JP 58064062, Shiraki Hiroyuki, "Semiconductor Memory", Patent Abstracts of Japan, vol. 7, No. 154, Jul. 6, 1983.
Yue Kuo, "Reaction Ion Etching of Sputter Deposited Tantalum Oxide and Its Etch Selectivity to Tantalum", Journal of the Electrochemical Society, vol. 139, No. 2, Feb. 1992, Manchester, N.H.
H. Okano, et al., "Down-Flow Process in VLSI Manufacturing", Extended Abstracts of the 20th (1988 International) Conference on Solid State Device and Materials, Aug. 24, 1988, Tokyo, pp. 549-552.
"Reactive Ion Etching of Tantalum Pentoxide", Shunji Seki et al., Journal Journal of the Electrochemical Society, pp. 2505-2506, 1983.
"A New Etchant for Thin Films of Tantalum and Tantalum Compounds", J. Grossman et al., Journal of the Electrochemical Society, p. 674, 1969.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-500942

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.