Method of manufacturing semiconductor device

Details Method of manufacturing semiconductor device Method of manufacturing semiconductor device

1991-11-29

1995-04-18

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437194, 437196, 437199, 437203, H01L 2144

Patent

active

054078636

ABSTRACT:
To improve electromigration resistance and stress migration resistance, when a film is formed by depositing Al or Al alloy on a semiconductor substrate, the film is formed stepwise by stepwise changing the heating temperature of the semiconductor substrate at at least two stages.

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patent: 5106781 (1992-04-01), Penning De Vries
patent: 5108951 (1992-04-01), Chen et al.
Dipankar Praminik and Arjun N. Saxena, "Aluminum Metallization for ULSI," Mar. 1990, Solid State Technology, vol. 33, No. 3; pp. 73-79.

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