Method of manufacturing semiconductor device

Details Method of manufacturing semiconductor device Method of manufacturing semiconductor device

1999-07-23

2000-06-06

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438118, 438123, 438127, H01L 2144, H01L 2148, H01L 2150

Patent

active

060717556

ABSTRACT:
A semiconductor device includes an encapsulating resin encapsulating a semiconductor substrate, a lead pattern or a laminated wiring layers transferred or secured on the lower surface of the encapsulating resin and a plurality of external electrode disposed on the lower surface of the lead pattern. The device may be manufactured by bonding a semiconductor substrate to a transferring substrate on which a lead pattern is formed, resin encapsulating an upper portion of the transferring substrate to cover the semiconductor substrate, and removing only the transferring substrate with the lead pattern left bonded to the encapsulating resin and the semiconductor substrate.

REFERENCES:
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5313365 (1994-05-01), Pennisi et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5394009 (1995-02-01), Loo
patent: 5450283 (1995-09-01), Lin et al.
patent: 5461197 (1995-10-01), Hiruta et al.
patent: 5554887 (1996-09-01), Sawai et al.
patent: 5578525 (1996-11-01), Mizukoshi
patent: 5619070 (1997-04-01), Kozono

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