Method of manufacturing semiconductor device

Details Method of manufacturing semiconductor device Method of manufacturing semiconductor device

1998-01-26

1999-11-02

Chaudhuri, Olik

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Substrate dicing

438 42, 438462, H01L 21784

Patent

active

059769041

ABSTRACT:
A method of manufacturing a semiconductor device for forming with high accuracy a marker used for separating a semiconductor device 10, wherein a plurality of semiconductor devices 10 are fabricated in a semiconductor substrate 16 are separated, and wherein etched grooves 31 are formed outside the semiconductor regions in the semiconductor substrate 16.

REFERENCES:
patent: 5436196 (1995-07-01), Miyashita
patent: 5567659 (1996-10-01), Pakulski et al.
patent: 5573976 (1996-11-01), Kato et al.
patent: 5593815 (1997-01-01), Ahn
patent: 5601687 (1997-02-01), Herrick
patent: 5629233 (1997-05-01), Chand et al.
patent: 5780320 (1998-07-01), Knoshita

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