Method of manufacturing semiconductor component

Details Method of manufacturing semiconductor component Method of manufacturing semiconductor component

1997-05-05

1998-07-28

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

216 14, 438106, B32B 3100, H01L 2100

Patent

active

057857911

ABSTRACT:
A polymeric organic coating (24) used to package a semiconductor component (10) increases voltage isolation, decreases thermal resistance, and increases scratch and abrasion resistance for the semiconductor component (10). The coating (24) is applied to a leadframe (14) of the semiconductor component (10) using a chemical grafting process that involves the use of monomers, prepolymers, a catalyst, a graft initiator, and other ingredients. The coating (24) forms a polymeric organic film that is chemically bonded to the surfaces of the leadframe (14). The chemical grafting process produces a chemical bond, which improves adhesion between the coating (24) and the leadframe (14).

REFERENCES:
patent: 3401049 (1968-09-01), Horowitz
patent: 3698931 (1972-10-01), Horowitz
patent: 5087962 (1992-02-01), De Vos et al.
patent: 5120803 (1992-06-01), Kitahara et al.
patent: 5309027 (1994-05-01), Letterman, Jr.
patent: 5328552 (1994-07-01), Banzoni
patent: 5483740 (1996-01-01), Maslakow

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