Method of manufacturing semiconductor chip and semiconductor...

Details Method of manufacturing semiconductor chip and semiconductor... Method of manufacturing semiconductor chip and semiconductor...

2011-08-02

2011-08-02

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Electrical characteristic sensed

C438S014000, C438S017000

Reexamination Certificate

active

07989227

ABSTRACT:
An FOM (figure of merit) enabling evaluation from a cost aspect, as well as evaluation of electrical performance, is newly proposed to provide a method of manufacturing based on the FOM a semiconductor chip intended for a lower cost production in addition to satisfying electrical performance. An FOMCof a semiconductor chip is defined as the product of a term represented by electrical performance of a substrate S and a term represented by a semiconductor chip cost CC; the FOMCof each of the semiconductor chips on substrates SS, SCof different type is determined by calculation of the product thereof. Based on the magnitudes of the calculation results, a desired substrate is selected from the substrates SS, SCand then a semiconductor chip is fabricated by forming a semiconductor element on the desired substrate selected.

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