Method of manufacturing semiconductor apparatus and method...

Details Method of manufacturing semiconductor apparatus and method... Method of manufacturing semiconductor apparatus and method...

2005-11-09

2010-06-15

Ward, Jessica L (Department: 1793)

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

Reexamination Certificate

active

07735717

ABSTRACT:
A method of manufacturing a semiconductor apparatus including a process of applying viscous liquid. The method applies viscous liquid onto a principal surface of a substrate, coats the viscous liquid closely with flexible coating material having a higher bonding strength with molecules of the viscous liquid than an intermolecular bonding strength of molecules of the viscous liquid, and then strips away the coating material together with part of the viscous liquid.

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