Method of manufacturing semiconductor apparatus

Details Method of manufacturing semiconductor apparatus Method of manufacturing semiconductor apparatus

2007-03-23

2010-10-26

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE21517

Reexamination Certificate

active

07820489

ABSTRACT:
A method of manufacturing a semiconductor apparatus includes forming an electrode on a semiconductor device, forming a conductive bump on the electrode, placing an external wire on the conductive bump, and laser-welding the external wire and the conductive bump to establish electrical connection.

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European Patent Office Search Report on Application No. 07007105.5 mailed Jul. 27, 2010; 6 pages.

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