Method of manufacturing semiconducting device with stacked dice

Details Method of manufacturing semiconducting device with stacked dice Method of manufacturing semiconducting device with stacked dice

2008-04-22

2010-06-22

Smoot, Stephen W (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S125000, C257SE21505

Reexamination Certificate

active

07741155

ABSTRACT:
Some embodiments of the present invention relate to a semiconducting device and method that include a substrate and a first die that is attached to the substrate. The first die includes active circuitry (e.g., a flash memory array or logic circuitry) on an upper surface of the first die. The semiconducting device further includes a spacer that covers the active circuitry on the upper surface of the first die and a second die that is stacked onto the spacer and the first die. The spacer extends from a first side of the first die to an opposing second side of the first die. The spacer also extends near a third side of the first die and an opposing fourth side of the first die such that the active circuitry is exposed near the third and fourth sides of the first die.

REFERENCES:
patent: 2002/0140073 (2002-10-01), Pai et al.
patent: 2002/0195697 (2002-12-01), Mess et al.

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