Method of manufacturing rotation detector having...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C156S272200, C156S060000, C156S001000, C219S121640, C250S453110, C250S492100

Reexamination Certificate

active

07918962

ABSTRACT:
A rotation detector includes a semiconductor chip, a nonmagnetic case body, a biasing permanent magnet and a nonmagnetic cap fixed to the case body, wherein the case body has a joint surface, and the cap has an inside surface in contact with the joint surface. A method of manufacturing the rotation detector includes the following steps: assembling the semiconductor chip, the case body and the biasing permanent magnet into a unit; forming at least one groove adjacent to the joint surface so as to form a space between the joint surface and the inside surface when the cap is fixed to the case body; fixing the cap to the case body so that the inside surface of the cap can be in contact with the joint surface; irradiating a laser beam at portions behind the inside surface of the cap under a prescribed pressure to melt materials of the case body and the cap and to make melted materials flow to the space; and cooling the melted materials to re-crystallize.

REFERENCES:
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patent: 6872911 (2005-03-01), Weiblen et al.
patent: 2004/0200569 (2004-10-01), Weiblen et al.
patent: 2005/0218123 (2005-10-01), Hayakawa et al.
patent: 2007/0075705 (2007-04-01), Kurumado
patent: 2007/0290679 (2007-12-01), Okui et al.
patent: A-2001-194244 (2001-07-01), None
patent: A-2003-214903 (2003-07-01), None
patent: A-2006-275639 (2006-10-01), None
patent: 2007040965 (2007-02-01), None
patent: A-2007-040965 (2007-02-01), None
patent: 2007232372 (2007-09-01), None
Office Action dated Aug. 25, 2009 from Japan Patent Office in corresponding JP application No. 2007-231975 (and English translation).

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