Method of manufacturing RFID

Details Method of manufacturing RFID Method of manufacturing RFID

2006-10-17

2006-10-17

Sells, James (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C228S110100

Reexamination Certificate

active

07122087

ABSTRACT:
There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the antenna. In the RFID, a PET film, a PEN film, or a sheet of paper is used as the base material of the antenna. The method includes: aligning the semiconductor chip with gold bumps relative to the antenna, in which a metal foil formed of an aluminum or an aluminum alloy is adhered to the base material, including a polyethylene terephthalate or a polyethylene naphthalate; pressing the semiconductor chip to the antenna; and applying ultrasonic waves under an ambient temperature lower than the glass transition temperature of the polyethylene terephthalate or the polyethylene naphthalate, to thereby bond the gold bumps and the metal foil. Thus, the method suppresses the deformation of the antenna.

REFERENCES:
patent: 6406990 (2002-06-01), Kawai
patent: 6523734 (2003-02-01), Kawai et al.
patent: 2003-203946 (2003-07-01), None

Affiliated with

Also associated with

Rating

Method of manufacturing RFID does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing RFID, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing RFID will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3717520