Method of manufacturing resin-sealed type semiconductor device

Details Method of manufacturing resin-sealed type semiconductor device Method of manufacturing resin-sealed type semiconductor device

1991-05-17

1992-12-08

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

2643285, 2643288, 26432816, B29C 4502, B29C 4514

Patent

active

051695863

ABSTRACT:
A method of manufacturing a resin-sealed type semiconductor device including heating sealing resin at a state of contacting the resin to a cull portion by means of a plunger during a predetermined period at the time the plunger stops its movement. The sealing resin is sufficiently heated to become low viscosity melting state. Thereafter, the melting state resin is injected into a cavity where resin sealing is performed.

REFERENCES:
patent: 1916495 (1933-07-01), Shaw
patent: 1993942 (1935-03-01), Novotny
patent: 4386898 (1983-06-01), Sera
patent: 4426341 (1984-01-01), Tsuzuku et al.
patent: 4569814 (1986-02-01), Chong et al.
patent: 4599062 (1986-07-01), Konishi
patent: 4927590 (1990-05-01), Poelzing
patent: 4983110 (1991-01-01), Yoshida et al.

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