Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-04-22
2008-04-22
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S592100, C029S825000, C029S832000
Reexamination Certificate
active
07360293
ABSTRACT:
A method of manufacturing a surface shape recognition sensor. A sacrificial film is formed on an interlevel dielectric to cover a lower electrode while keeping an upper portion of a support electrode exposed. An upper electrode is formed on the sacrificial film and support electrode. The sacrificial film is selectively removed and a protective film is formed on the upper electrode. A photosensitive resin film having photosensitivity is formed on the protective film. A plurality of projections are formed in a region of the protective film above a capacitive detection element. In this manner a plurality of capacitive detection elements each having the lower electrode and upper electrode are formed.
REFERENCES:
patent: 6060756 (2000-05-01), Machida et al.
patent: 6248655 (2001-06-01), Machida et al.
patent: 6494096 (2002-12-01), Sakai et al.
patent: 6518083 (2003-02-01), Sato et al.
patent: 7045379 (2006-05-01), Tanabe et al.
patent: 61-221883 (1986-10-01), None
patent: 3-006791 (1991-01-01), None
patent: 5-061965 (1993-03-01), None
patent: 6-232343 (1994-08-01), None
patent: 7-168930 (1995-07-01), None
patent: 11-248410 (1999-09-01), None
patent: 2000-018908 (2000-01-01), None
patent: 2000-065514 (2000-03-01), None
patent: 2000-199701 (2000-07-01), None
Yoshimasa Shimizu et al., “A Study on the Structure of a Smart Card with the Function to Verify the Holder”, Technical Report of IEICE OFS92-32, pp. 25-30 (Nov. 1992).
Marco Tartagni and Robert Guerrieri, A 390 dpi Live Fingerprint Imager Based on Feedback Capacitive Sensing Scheme, 1997 IEEE International Solid-State Circuits Conference, pp. 200-201 (1997).
P. Rey et al., “A High Density Capacitive Pressure Sensor Array for Fingerprint Sensor Application”, IEEE International Conference on Solid-State Sensors and Actuators, pp. 1453-1456 (1997).
Ishii Hiromu
Kyuragi Hakaru
Machida Katsuyuki
Morimura Hiroki
Sato Norio
Arbes Carl J.
Blakely & Sokoloff, Taylor & Zafman
Nippon Telegraph and Telephone Corporation
LandOfFree
Method of manufacturing recognition sensor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing recognition sensor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing recognition sensor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2748895