Method of manufacturing probe card

Details Method of manufacturing probe card Method of manufacturing probe card

1996-04-26

1998-11-03

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29593, 324757, H01R 900

Patent

active

058291261

ABSTRACT:
Bumps to be connected to inspection electrodes of semiconductor chips are formed on a surface of a flexible substrate. A plating layer is formed which is made of a harder material than the bumps formed on the flexible substrate and which has a concave portion or a convex portion whose diameter is equal to or smaller than half the diameter of the bumps, on a flat metallic plate. The plating layer of the metallic plate is pressed against top surfaces of the bumps, so that irregularities are formed in the top surfaces of the bumps.

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patent: 5008614 (1991-04-01), Shreeve et al.
patent: 5356661 (1994-10-01), Doi et al.
patent: 5430614 (1995-07-01), DiFrancesco
patent: 5545589 (1996-08-01), Tomura et al.
patent: 5606263 (1997-02-01), Yoshizawa et al.
patent: 5642055 (1997-06-01), DiFrancesco

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