Method of manufacturing printed wiring boards

Details Method of manufacturing printed wiring boards Method of manufacturing printed wiring boards

1984-09-10

1985-05-21

Tufariello, Thomas

Chemistry: electrical and wave energy

Processes and products

204 24, C25D 502, C25D 704

Patent

active

045184658

ABSTRACT:
A base substrate of a printed wiring board is coated, by wet plating, with metal films over two major surfaces thereof and the inner walls of through-holes formed therein wherein the metal films formed over the inner walls of the through-holes form via-holes for electrically connecting the metal films formed over the two surfaces with each other. In the wet plating, the base substrate is taken out of the plating bath for a first predetermined period of time, to thereby cause disintegration of bubbles on the surfaces of the base substrate and the inner walls of the through-holes therein. Then, the base substrate is again immersed into the plating bath for a second predetermined period of time to resume the formation of the metal films.

REFERENCES:
patent: 3532801 (1970-10-01), Faulkner
patent: 3554878 (1971-01-01), Rothschild
patent: 3558441 (1971-01-01), Chadwick
patent: 3798136 (1974-03-01), Olsen
patent: 4217182 (1980-08-01), Cross

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