Metal working – Method of mechanical manufacture – Electrical device making
Patent
1989-11-02
1991-10-01
Gorski, Joseph M.
Metal working
Method of mechanical manufacture
Electrical device making
H05K 328
Patent
active
050521039
ABSTRACT:
A method of manufacturing a printed wiring board includes a step of providing a plurality of pierced holes in prescribed positions of a laminate which is formed by adhering electrolytic conductive metal foils on front and rear surfaces of a laminate mainly composed of resin, a step of dipping the laminate completely provided with the pierced holes in unhardened liquid thermosetting resin, a step of removing excessive parts of the thermosetting resin applied onto the front and rear surfaces of the laminate and inner peripheral walls surfaces of the pierced holes, a step of heating and hardening the applied thermosetting resin, a step of removing parts of the thermosetting resin hardened on the conductive metal foils provided on the front and rear surfaces of the laminate, and a step of forming plating layers of a conductive metal on the front and rear surfaces of the laminate and the inner peripheral wall surfaces of the pierced holes. A printed wiring board having an excellent insulation property between through-holes can be manufactured through the aforementioned steps.
REFERENCES:
patent: 4585502 (1986-04-01), Uozu et al.
patent: 4593069 (1986-06-01), Kamagata et al.
J. P. Mitchell et al., of Bell Telephone Laboratories, "Conductive Anodic Filament Growth in Printed Circuit Materials, Printed Circuit World Convention II, '81".
Dungba Vo Peter
Gorski Joseph M.
Sharp Kabushiki Kaisha
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