Method of manufacturing printed wiring board having no copper mi

Metal working – Method of mechanical manufacture – Electrical device making

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H05K 328

Patent

active

050521039

ABSTRACT:
A method of manufacturing a printed wiring board includes a step of providing a plurality of pierced holes in prescribed positions of a laminate which is formed by adhering electrolytic conductive metal foils on front and rear surfaces of a laminate mainly composed of resin, a step of dipping the laminate completely provided with the pierced holes in unhardened liquid thermosetting resin, a step of removing excessive parts of the thermosetting resin applied onto the front and rear surfaces of the laminate and inner peripheral walls surfaces of the pierced holes, a step of heating and hardening the applied thermosetting resin, a step of removing parts of the thermosetting resin hardened on the conductive metal foils provided on the front and rear surfaces of the laminate, and a step of forming plating layers of a conductive metal on the front and rear surfaces of the laminate and the inner peripheral wall surfaces of the pierced holes. A printed wiring board having an excellent insulation property between through-holes can be manufactured through the aforementioned steps.

REFERENCES:
patent: 4585502 (1986-04-01), Uozu et al.
patent: 4593069 (1986-06-01), Kamagata et al.
J. P. Mitchell et al., of Bell Telephone Laboratories, "Conductive Anodic Filament Growth in Printed Circuit Materials, Printed Circuit World Convention II, '81".

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