Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-12-26
2010-12-28
Phan, Thiem (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S025420, C029S825000, C029S829000, C029S831000, C029S842000, C029S846000, C174S250000, C174S260000, C174S262000, C257S531000, C257S664000, C257S678000, C257S698000
Reexamination Certificate
active
07856710
ABSTRACT:
A method of manufacturing a printed wiring board including preparing a high-dielectric capacitor sheet including a ceramic high-dielectric layer sandwiched by upper and lower electrode sheets, attaching the high-dielectric capacitor sheet to a first insulating layer, forming through holes for the upper and lower electrode sheets such that the through holes penetrate through the ceramic high-dielectric layer and upper and lower electrode sheets, forming a second insulating layer which fills the through holes and covers an upper surface of the high-dielectric capacitor sheet, forming an upper electrode connecting first hole, an upper electrode connecting second hole and a lower electrode connecting hole, filling the upper holes with conductive material such that the upper electrode connecting first hole and the upper electrode connecting second hole are connected to form an upper electrode connection portion, and filling the lower electrode connecting hole with conductive material to form a lower electrode connecting portion.
REFERENCES:
patent: 5387888 (1995-02-01), Eda et al.
patent: 5745333 (1998-04-01), Frankeny et al.
patent: 6005197 (1999-12-01), Kola et al.
patent: 6218729 (2001-04-01), Zavrel et al.
patent: 6274224 (2001-08-01), O'Bryan et al.
patent: 6512182 (2003-01-01), Takeuchi et al.
patent: 6677630 (2004-01-01), Kanaya et al.
patent: 6822170 (2004-11-01), Takeuchi et al.
patent: 6910266 (2005-06-01), Lee et al.
patent: 6952049 (2005-10-01), Ogawa et al.
patent: 6970363 (2005-11-01), Bassett et al.
patent: 2001/0026444 (2001-10-01), Matsushima et al.
patent: 2003/0215619 (2003-11-01), Ooi et al.
patent: 2004/0108134 (2004-06-01), Borland et al.
patent: 2004/0231885 (2004-11-01), Borland et al.
patent: 1458815 (2003-11-01), None
patent: 0563873 (1993-10-01), None
patent: 2-177350 (1990-07-01), None
patent: 2003-332752 (2003-11-01), None
patent: 2004-87971 (2004-03-01), None
patent: WO 00/45624 (2000-08-01), None
Kariya Takashi
Mochida Akira
Ibiden Co. Ltd.
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Phan Thiem
LandOfFree
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