Method of manufacturing printed wiring board

Details Method of manufacturing printed wiring board Method of manufacturing printed wiring board

1992-10-28

1994-01-11

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C25D 502

Patent

active

052777871

ABSTRACT:
A method of manufacturing printed wiring board is disclosed. The method comprising steps of providing a double-sided copper clad laminate; embedding a conductive ink into a through hole provided in the copper clad laminate; subjecting the opposing surfaces of the double-sided copper clad laminate to copper electroplating to form a copper plated layer after curing the conductive ink under the given conditions; providing a circuit for displacing component mounting lands onto the copper plated layer directly over the cured conductive ink with the use of a dry film or ink for forming other circuit; and forming a printed wiring circuit with the material removing treatment.

REFERENCES:
patent: 4808273 (1989-02-01), Hua

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