Method of manufacturing printed wiring board

Details Method of manufacturing printed wiring board Method of manufacturing printed wiring board

1992-01-06

1994-04-19

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427259, 427282, 1566611, B05D 512, B44C 122

Patent

active

053043928

ABSTRACT:
According to the present invention, inequality in the film thickness of the solder resist and the occurrence of the blur can be eliminated, and it is possible to perform a screen printing for the solder resist with a minute pattern which leads to the formation of a minute solder land.
A solder resist 60 is screen printed while leaving an etching resist 3 in the step for forming a printed wiring circuit 5 on the front of an insulating board 4. Afterward, the etching resist and the overlaid solder resist 60a are simultaneously removed, thereby forming a flat surface over the printed wiring circuit 5.

REFERENCES:
patent: 4732649 (1988-03-01), Larson et al.
patent: 4994349 (1991-02-01), Blumenstock et al.

Affiliated with

Also associated with

Rating

Method of manufacturing printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing printed wiring board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-18616