Method of manufacturing printed circuits

Details Method of manufacturing printed circuits Method of manufacturing printed circuits

1981-06-08

1984-02-21

Powell, William A.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

29582, 156645, 156655, 1566591, 156668, 156902, 174 685, 427307, 430312, 430315, B05D 512, B05D 304, B44C 122, C03C 1500

Patent

active

044330090

ABSTRACT:
In accordance with the method of manufacturing printed circuits, a base material is provided with a plurality of holes in correspondence with the required conductors pattern, the base material with the holes is coated by a photopolymer layer, the photopolymer layer is selectively exposed and developed so as to release zones and boreholes for forming conductive paths, solder eyes and connecting contacts between both sides of the plate, then the layer of the current conductive material is applied in the regions of the thus released zones and boreholes so as to form the above-mentioned conductive paths, solder eyes and connecting contacts.

REFERENCES:
patent: 4268614 (1981-05-01), Ueyama et al.
patent: 4283243 (1981-08-01), Andreads et al.
patent: 4285991 (1981-08-01), Gedrat et al.

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