Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1994-02-07
1995-10-17
Beck, Shrive P.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427304, 427305, B05D 512
Patent
active
054589070
ABSTRACT:
A method of manufacturing a printed wiring board includes the following steps. A circuit pattern consisting of one material selected from the group consisting of copper and a copper alloy is selectively formed on an insulating substrate, and a solder resist is then formed on the insulating substrate except for a region in which the circuit pattern is formed. A copper oxide and a copper impurity produced on surfaces of the solder resist and the circuit pattern formed on the insulating substrate are removed. A copper oxide coating is uniformly formed on the surface of the circuit pattern from which the copper oxide and copper impurity are removed. A oxidation-proof coating consisting of an imidazole-based pre-flux is formed by substituting the copper oxide coating on the surface of the circuit pattern with imidazole.
REFERENCES:
"Printed Circuit Technique Handbook" Feb., 1987, pp. 818-825.
"The formation of a compact polymer film on a copper electrode from benzimidazole solution" 1989, pp. 163-173 (no month date).
The Condensed Chemical Dictionary, 10th Edition, Revised by G. G. Hawley, Van Nostrand Reinhold Company, 1981, p. 431.
Bareford Katherine A.
Beck Shrive P.
NEC Corporation
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