Method of manufacturing printed circuit boards

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156 56, 156247, 156289, 29424, 29852, 427 97, B44C 116, B32B 3100, B21D 100

Patent

active

048820008

ABSTRACT:
The present invention relates to a method of manufacturing printed circuit boards.
The manufacturing method of printed circuit boards under the present invention is to detach a release paper from a metal board on which holes are provided and to which the adhesive sheet and a release paper are attached. Thereafter, the metal board is glued to a resin board having at least one circuit layer and at least either of through holes or lead wire holes, by means of the adhesive sheet by pressing.
An alternative manufacturing method of printed circuit boards under the present invention is to provide lead wire holes at the centers of resin filled holes in a metal board material, and to which an adhesive sheet and a release paper are attached. From the metal board material, a metal board is made by finishing its outer configuration. The release paper is detached from the metal board. Thereafter, the metal board is glued by pressing to a resin board having at least one circuit layer and at least either of through holes or lead wire holes, by means of the adhesive sheet.

REFERENCES:
patent: 3984598 (1976-10-01), Sarazin et al.
patent: 4445952 (1984-05-01), Reynolds, III et al.
patent: 4478884 (1984-10-01), Banes et al.
patent: 4522667 (1985-06-01), Hanson et al.
patent: 4591659 (1986-05-01), Leibowitz
patent: 4663208 (1987-05-01), Ninomiya et al.
Scotch.RTM., "VHB" Joining System; Product Information for Y-4930, Y-4950, 4945, 4965 and Y-9473, Apr., 1983.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing printed circuit boards will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1424097

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.