Method of manufacturing printed circuit boards

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29830, 156150, 174 685, H05K 310

Patent

active

048172804

ABSTRACT:
The present invention relates to a method of manufacturing printed circuit boards.
The method of manufacturing printed circuit boards under the present invention is to provide holes on a metal plate, to attach a prepreg to the metal plate, and to fill the prepreg into the holes by heat-pressing the metal plate to which the prepreg is attached. Thereafter, lead wire holes are provided at the centers of prepreg filled the holes, and a resin plate having at least one circuit layer and through holes is glued to the metal plate. Alternately, a resin plate having at least one circuit layer and lead wire holes, or a resin plate having at least one circuit layer, through holes and lead wire holes are glued to the metal plate on the side where the prepreg is attached.

REFERENCES:
patent: 3932932 (1976-01-01), Goodman
patent: 4445952 (1984-05-01), Reynolds, III et al.
patent: 4496793 (1985-01-01), Hanson et al.

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