Method of manufacturing printed circuit board and...

Details Method of manufacturing printed circuit board and... Method of manufacturing printed circuit board and...

2005-06-07

2005-06-07

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C205S067000, C205S078000

Reexamination Certificate

active

06902660

ABSTRACT:
Disclosed is a fabrication method of a printed circuit board, consisting of plating a metal on a pattern-formed metallic substrate to form a conductive metal line; forming a polymer layer as a base substrate over the conductive metal line-formed metallic substrate and drying the formed polymer layer; forming a via hole in the polymer layer, followed by plugging the formed via hole by electroplating; and removing the metallic substrate. The method is advantageous in terms of maximum efficiency of use of the surface area of PCB, and fineness and high integration of circuits because of not requiring an additional etching process.

REFERENCES:
patent: 4912020 (1990-03-01), King et al.
patent: 5046238 (1991-09-01), Daigle et al.
patent: 5077084 (1991-12-01), Konotsune et al.
patent: 6296949 (2001-10-01), Bergstresser et al.
patent: 6521530 (2003-02-01), Peters et al.

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