Method of manufacturing printed circuit board

Details Method of manufacturing printed circuit board Method of manufacturing printed circuit board

2008-06-18

2011-12-13

Cazan, Livius R (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S852000, C174S258000, C174S264000

Reexamination Certificate

active

08074352

ABSTRACT:
A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer.

REFERENCES:
patent: 4368503 (1983-01-01), Kurosawa et al.
patent: 6039889 (2000-03-01), Zhang et al.
patent: 10-0704920 (2007-04-01), None

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