Method of manufacturing printed circuit board

Details Method of manufacturing printed circuit board Method of manufacturing printed circuit board

2010-07-22

2011-11-29

Lam, Cathy (Department: 1784)

Metal working

Method of mechanical manufacture

Electrical device making

C029S847000, C216S013000, C216S039000, C216S066000, C205S125000, C427S097800, C427S098500, C427S124000, C427S154000, C427S301000, C427S533000, C427S552000

Reexamination Certificate

active

08065798

ABSTRACT:
A fabrication method which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The method for fabricating a printed circuit board includes: providing an insulating material; forming in the insulating material at least one via-hole for interlayer electrical connection; ion beam treating the surface of the insulating material having the via-hole formed therein; forming a copper seed layer on the surface-treated insulating material using a vacuum deposition process; and plating a copper pattern on the copper seed layer to form a circuit pattern.

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