Method of manufacturing printed circuit board

Details Method of manufacturing printed circuit board Method of manufacturing printed circuit board

2007-12-31

2009-10-13

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S852000, C029S842000, C148S432000, C420S473000

Reexamination Certificate

active

07600315

ABSTRACT:
This invention relates to a method of manufacturing a printed circuit board, in which a dummy metal frame enclosing the outer periphery of a product part is formed, thus simultaneously assuring the rigidity of the printed circuit board and minimizing the warping thereof thanks to the dummy metal frame left in place on a finished product, thereby realizing a structure compatible with conventional flip chip mounting lines.

REFERENCES:
patent: 6749699 (2004-06-01), Bogel et al.
patent: 2004/0091821 (2004-05-01), Appelt et al.
patent: 2005/0028363 (2005-02-01), Khandros
patent: 2006/0012028 (2006-01-01), Usui et al.
patent: 2007/0261234 (2007-11-01), Song et al.

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