Method of manufacturing printed circuit board

Details Method of manufacturing printed circuit board Method of manufacturing printed circuit board

2011-07-05

2011-07-05

Gray, Linda L (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S249000, C156S252000, C156S257000, C156S268000, C156S233000, C156S237000, C156S151000, C156S240000, C174S264000, C438S653000, C216S018000

Reexamination Certificate

active

07972460

ABSTRACT:
Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for connecting one layer to another layer can include forming a circuit pattern on one surface of a carrier; processing a hole corresponding to the via on one surface of the carrier; compressing the surface of the carrier into one surface of an insulation body; removing the carrier; processing a via hole on the insulation body, corresponding to a position of the hole; and forming a conductive material in the via hole, to thereby easily process a hole for forming a via and have high design freedom.

REFERENCES:
patent: 2003/0143837 (2003-07-01), Gandikota et al.
patent: 2006/0191715 (2006-08-01), Koyama et al.

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