Method of manufacturing power semiconductors with pressed contac

Details Method of manufacturing power semiconductors with pressed contac Method of manufacturing power semiconductors with pressed contac

1978-01-10

1979-05-22

Smith, John D.

Metal working

Method of mechanical manufacture

Electrical device making

29589, 29591, 156630, 156665, 427 89, 427 90, 427 91, 427125, 427229, H01L 2144

Patent

active

041551559

ABSTRACT:
The invention relates to a method of manufacturing power semiconductors with pressed contacts and with an interdigitated structure. The thickest contact metal coverings are formed by application of a metal layer by serigraphy on a first thin metal layer deposited by evaporation in a vacuum.

REFERENCES:
patent: 3007092 (1961-10-01), Cooper
patent: 3037180 (1962-05-01), Linz, Jr.
patent: 3222216 (1965-12-01), Berkenblit et al.
patent: 3453501 (1969-07-01), Dunkle
patent: 3545076 (1970-12-01), Schulten
patent: 3993515 (1976-11-01), Reichert

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