Method of manufacturing polyimide multilayer printed wiring boar

Details Method of manufacturing polyimide multilayer printed wiring boar Method of manufacturing polyimide multilayer printed wiring boar

1994-04-15

1995-07-04

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

216 83, 216 91, 216100, 428209, B44C 122, C23F 102

Patent

active

054297095

ABSTRACT:
An etching process of a conductive layer in manufacturing polyimide multilayer printed wiring boards comprises the steps of dipping in an alkali aqueous solution for patterning the conductive layer, dipping in an acid aqueous solution for neutralizing the alkali residue, and washing with water thereby washing off the alkali residue. A curing process for each of polyimide layers is controlled so as to obtain a polyimide conversion ratio ranging between 60% and 100% after an initial curing process, and to obtain a polyimide conversion ratio close to 100% after formation of an uppermost polyimide layer.

REFERENCES:
patent: 5322593 (1994-06-01), Hasegawa et al.
patent: 5378310 (1995-01-01), Satoh et al.

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