Plastic and nonmetallic article shaping or treating: processes – Pore forming in situ – By gas forming or expanding
Reexamination Certificate
2006-11-07
2006-11-07
Kuhns, Allan R. (Department: 1732)
Plastic and nonmetallic article shaping or treating: processes
Pore forming in situ
By gas forming or expanding
C264S219000, C264S255000, C264S317000
Reexamination Certificate
active
07132070
ABSTRACT:
A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the polymer foam material into a molding polymer article. A mold release process is performed to obtain the molding polymer article. The strip on the molding article is removed to form a polishing pad having at least one groove thereon.
REFERENCES:
patent: 4841680 (1989-06-01), Hoffstein et al.
patent: 5061427 (1991-10-01), Hirzel
patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5489233 (1996-02-01), Cook et al.
patent: 5569062 (1996-10-01), Karlsrud
patent: 5989470 (1999-11-01), Doan et al.
patent: 6022268 (2000-02-01), Roberts et al.
patent: 6095902 (2000-08-01), Reinhardt
patent: 6267659 (2001-07-01), Chen et al.
patent: 6290883 (2001-09-01), Crevasse et al.
patent: 6531078 (2003-03-01), Laine et al.
patent: 6627671 (2003-09-01), Kihara et al.
patent: 6641471 (2003-11-01), Pinheiro et al.
patent: 6645264 (2003-11-01), Hasegawa et al.
patent: 6758735 (2004-07-01), Blalock
patent: 6777455 (2004-08-01), Seyanagi et al.
patent: 6786945 (2004-09-01), Machii et al.
patent: 6848974 (2005-02-01), Hasegawa et al.
patent: 2004/0021243 (2004-02-01), Shih et al.
patent: 04-249116 (1992-09-01), None
patent: 2001-232554 (2004-08-01), None
patent: 491755 (2000-06-01), None
patent: WO 02/067309 (2002-08-01), None
Chang Yung-Chung
Chu Min-Kuei
Shih Wen-Chang
Wei Lung-Chen
IV Technologies Co., Ltd.
J.C. Patents
Kuhns Allan R.
LandOfFree
Method of manufacturing polishing pad does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing polishing pad, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing polishing pad will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3684035