Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1997-12-16
2000-07-04
Utech, Benjamin
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
438710, 438715, 438717, 438723, 156643, 156647, H01L 21306
Patent
active
060838434
ABSTRACT:
The present invention is an improved method of pigtailing of high-density Wavelength Division Multiplex (WDM) components, achieved by etching silicon V-grooves for locating the fibres after completion of the PLC device fabrication processes. This avoids the need for etching or pre-patterning of the V-grooves on substrates before device fabrication, and hence avoids any of the waveguide to fibre alignment problems that have been found in the methods of the prior art.
REFERENCES:
patent: 5217568 (1993-06-01), Tessier et al.
patent: 5342478 (1994-08-01), Welbourn
patent: 5471552 (1995-11-01), Wuu et al.
Moule David John
Ohja Sureshchandra Mishrilal
Rogers Colin Brian
Northern Telecom Limited
Utech Benjamin
Vinh Lan
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