Method of manufacturing photosensitive semiconductor device

Details Method of manufacturing photosensitive semiconductor device Method of manufacturing photosensitive semiconductor device

1998-11-03

2000-03-14

Picardat, Kevin M.

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

438 22, 438 23, 438 25, H01L 2100

Patent

active

060371889

ABSTRACT:
The present invention provides a photosensitive semiconductor device comprising a sealing body composed of a resin material for sealing photosensitive semiconductor elemental devices, a inside of the sealing body having a light-transmissive property, a surface of the sealing body composed of the resin material containing carbon.
Owing to the above-described construction, the present invention can provide a photosensitive semiconductor device which eliminates the need for a mold resin forming process for forming only a lightproof film and is capable of simplifying a manufacturing process thereof and being rendered compact in size.

REFERENCES:
patent: 5669299 (1997-09-01), Ando et al.
patent: 5734155 (1998-03-01), Rostoker
patent: 5753344 (1998-05-01), Jacobson

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