Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Having diverse electrical device
Patent
1999-04-23
2000-03-14
Picardat, Kevin M.
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Having diverse electrical device
438 26, 438 27, H01L 2100
Patent
active
060371870
ABSTRACT:
In order to prevent deterioration of adhesion between a molding resin and a lead frame and a light transmission characteristic due to the attachment of a translucent resin to an upper surface of the lead frame upon charging a photocoupler with the translucent resin, a concave portion is provided in an island of a lead frame to which the smallest semiconductor device is attached. The filling of the translucent resin between opposed semiconductor devices includes filling through the concave portion. The provision of the concave portion prevents the translucent resin from contacting the upper surface, resulting in a more stable configuration.
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OKI Electric Industry Co., Ltd.
Picardat Kevin M.
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