Method of manufacturing photo couplers

Details Method of manufacturing photo couplers Method of manufacturing photo couplers

2006-08-28

2010-02-23

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S123000, C257SE25006, C257SE23042

Reexamination Certificate

active

07666710

ABSTRACT:
A method of manufacturing photo couplers is provided. At first, a receiver lead-frame array is cut from a lead-frame matrix having a transmitter lead-frame array and the receiver lead-frame array. Then, the receiver lead-frame array is overturned and placed on the lead-frame matrix to allow light-receiver elements on the receiver lead-frame array to face light-emitting elements on the transmitter lead-frame array of the lead-frame matrix. Finally, the receiver lead-frame array and the lead-frame matrix are connected.

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