Method of manufacturing package substrate with fine circuit...

Details Method of manufacturing package substrate with fine circuit... Method of manufacturing package substrate with fine circuit...

2007-01-30

2007-01-30

Norton, Nadine (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

C438S719000, C361S764000, C427S383700, C427S405000

Reexamination Certificate

active

11011401

ABSTRACT:
Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other. Further, by electroplating portions provided between the oxidation layers with copper or filling conductive paste between the oxidation layers using a screen, a package substrate having a fine circuit pattern is achieved.

REFERENCES:
patent: 6300686 (2001-10-01), Hirano et al.
patent: 6486006 (2002-11-01), Hirano et al.
patent: 6620731 (2003-09-01), Farnworth et al.
patent: 2004/0113244 (2004-06-01), Shin et al.
Korean Publication No. 1020030073919 A published Sep. 19, 2003.

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