Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1986-07-10
1987-07-07
Hearn, Brian E.
Metal working
Method of mechanical manufacture
Assembling or joining
29589, 29840, 29843, 29832, 357 74, 357 80, 357 71, 357 81, H01L 2156
Patent
active
046777415
ABSTRACT:
A semiconductor device is provided within an outer container (21) made of a ceramic which is of a box shape having an opening in an upper portion thereof and a bottom plate and also having a stepped portion (21a) at the position in an intermediate height of an inner wall of side plates. A metalized layer (22) is deposited in inner and outer surfaces of the bottom plate and a surface of the stepped portion. A metal plate (30) is brazed by a silver solder (26) on the metalized layer of the outer surface of the bottom plate and at the same time, a common metal substrate (27) is also brazed by a silver solder (26) on the metalized layer (22) on the inner surface of the bottom plate. A plurality of external electrodes (23, 23', 24, 25) in a frame shape of a conductor plate are connected to the metalized layer (22) of the surface of the stepped portion (21a) by a silver solder (26). A heat sink plate (10 ) is connected to the common metal substrate (27) by means of soldering (6) and a semiconductor chip (7, 28) is soldered on the heat sink plate (10). After a semiconductor chip (7, 28) is electrically connected to the plurality of electrodes (23, 23', 24, 25) and the metal plate (30), the container (21) is filled with a soft resin (12) for sealing.
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Hearn Brian E.
Mitsubishi Denki & Kabushiki Kaisha
Pawlikowski Beverly A.
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