Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2006-01-31
2006-01-31
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C438S034000, C438S099000, C438S669000
Reexamination Certificate
active
06991954
ABSTRACT:
A metal layer A constituting the stripe-shaped cathode electrode is formed on the surface of the organic electroluminescence layer13, a peeling film B is stuck to the surface of the metal layer A through such an adhesive C as to reduce adhesion to the metal layer by the irradiation of ultraviolet light, and a pattern according to the stripe-shaped cathode electrodes14is baked onto the peeling film B by the irradiation of ultraviolet light E by using a mask D and the peeling film B is then peeled from the organic electroluminescence layer13.
REFERENCES:
patent: 6652700 (2003-11-01), Namikawa et al.
Buchanan & Ingersoll PC
Fourson George
Maldonado Julio
Rohm & Co., Ltd.
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