Method of manufacturing optical modulator

Details Method of manufacturing optical modulator Method of manufacturing optical modulator

2007-11-06

2007-11-06

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S600000, C029S830000, C359S245000, C359S249000, C385S002000, C385S003000, C385S008000, C430S015000, C430S016000, C430S018000

Reexamination Certificate

active

10942562

ABSTRACT:
Major surface of a substrate having an optical waveguide and a modulation electrode is pasted to a base substrate through a thermosetting resin, and then the rear surface of the substrate is machined thus making thin the entirety. Subsequently, the rear surface of the substrate thus rendered thin is subjected to machining or laser machining to form a thin part, which is further subjected to machining or laser machining to form a first thin part at a part, including the optical waveguide, of the thin part and a second thin part thinner than the first thin part contiguously thereto. Thereafter, the rear surface of the substrate is pasted to the major surface of a supporting substrate through a thermosetting resin and the base substrate is stripped thus obtaining an optical modulator.

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Yoshinori Kondo et al., “C-3-53 40Gb/s-yo X-cut LiNbO3Hikari Henchoki Module”, 2002 nen The Institute of Electronics, Information and Communication Engineers Sogo Taikai Koen Ronbunshu, vol. 2002, Electronics 1, Mar. 7, 2002, p. 185 (and Partial English Translation).
Yoshinori Kondo et al., “c-3-3 40Gb/s·2. 8Vx-cut LiNbO3 Uramizo Tsuki Hikari Henchoki”, 2001 nen The Institute of Electronics, Information and Communication Engineers Electronics Society Taikai Koen Ronbunshu, vol. 2001, Society CI, Aug. 29, 2001, p. 113 (and Partial English Translation).
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