Method of manufacturing optical crystal element of laser

Details Method of manufacturing optical crystal element of laser Method of manufacturing optical crystal element of laser

2006-07-11

2006-07-11

Goudreau, George A. (Department: 1763)

Etching a substrate: processes

Forming or treating optical article

C216S057000, C216S060000, C216S066000, C216S075000, C216S088000

Reexamination Certificate

active

07074342

ABSTRACT:
A method of manufacturing an optical crystal element of a laser device includes measuring an initial thickness of a crystal substrate formed of YAG or YVO4; introducing a mixture of a fluorine gas and an Ar gas having a ratio of the fluorine gas to the Ar gas in a range of 1:10 to 1:2 into a process chamber holding the crystal substrate; and generating ion beams of the mixture in the process chamber for etching a surface of the crystal substrate for a period time determined from an etching rate depending on the ratio of the mixture and the initial thickness of the crystal substrate. Thickness of the optical crystal element is controlled to a desired thickness. In the method, it is possible to produce the optical crystal element of a microchip laser having functions as a laser medium, a resonator and an etalon.

REFERENCES:
patent: 6942812 (2005-09-01), Tateno et al.
patent: 01-104760 (1989-04-01), None
patent: 06-224510 (1994-08-01), None
“Improvement of surface laser damage resistance in CsLiB6010 cyrstal for high-power UV lasers”; Proceedings of SPIE (2000); vol. 3889; Kamiura et. al.; pp. 464-471.
“A ytterbium- and neodymium-co-doped yttrium aluminum garnet-buried channel waveguide laser pumped at 0.81 um”; Applied Physics Letters (1995); 67 (5); pp. 582-584; Sugimoto et. al.

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