Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-07-14
1998-03-31
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
29832, 295641, 206707, 26427217, H05K 330
Patent
active
057324654
ABSTRACT:
A one side resin sealing type semiconductor device has a semiconductor element which is mounted on one side of a circuit board. Wiring patterns are provided on both sides of the circuit board. The semiconductor element mount portion is sealed with resin. External connecting terminals, such as soldering balls, are joined to the wiring pattern on the other side of the circuit board. The method of manufacturing one side resin sealing type semiconductor devices includes the steps of: positioning and disposing the circuit board formed into an individual piece corresponding to a through-hole formed in a rectangular carrier frame; and conveying the circuit board supported by the carrier frame so as to conduct a series of processing steps such as mounting the semiconductor element, electrically connecting the semiconductor element with the wiring pattern, sealing the semiconductor element mount portion with resin, and connecting the wiring pattern with the external connecting terminals.
REFERENCES:
patent: 4617708 (1986-10-01), Fanning
patent: 5085362 (1992-02-01), Art et al.
patent: 5119934 (1992-06-01), Karasawa et al.
patent: 5218759 (1993-06-01), Juskey et al.
patent: 5297331 (1994-03-01), Childers
patent: 5309322 (1994-05-01), Wagner et al.
patent: 5472085 (1995-12-01), Gelzer
Patent Abstracts Of Japan, vol. 015 No. 108 (E-1045), 14 Mar. 1991, & JP-A-03 001560 (Oki Electric Ind Co Ltd) 8 Jan. 1991.
Higashi Mitsutoshi
Tokita Masakuni
Echols P. W.
Shinko Electric Industries Co. Ltd.
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