Method of manufacturing of semiconductor device having low leaka

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

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257306, 257305, 257647, H01L 27108

Patent

active

060283610

ABSTRACT:
A field oxide film is provided in the surface of a semiconductor substrate. An interlayer insulating film is provided on the semiconductor substrate so as to cover an active layer. A contact hole exposing the surface of the active layer is provided in the interlayer insulating film. A conductor fills the contact hole so as to be electrically connected to the surface of the active layer. The end portion of the field oxide film has a surface perpendicular with respect to the surface of the semiconductor substrate. As a result, a dynamic random access memory can be obtained which is improved so that leakage current is reduced, which in turn increases a hold time of information.

REFERENCES:
patent: 4277881 (1981-07-01), Godejahn et al.
patent: 4549914 (1985-10-01), Oh
patent: 4764248 (1988-08-01), Bhattacherjee et al.
patent: 4903107 (1990-02-01), Wei
patent: 4933742 (1990-06-01), Brown et al.
patent: 4980748 (1990-12-01), Hozumi et al.
patent: 5057902 (1991-10-01), Haskell
patent: 5065222 (1991-11-01), Ishii
patent: 5070386 (1991-12-01), Imura
patent: 5168343 (1992-12-01), Sakamoto
patent: 5208470 (1993-05-01), Lee et al.
patent: 5248891 (1993-09-01), Takato et al.
patent: 5334869 (1994-08-01), Iguchi et al.
patent: 5512778 (1996-04-01), Chung et al.

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