Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2007-03-22
2011-10-25
Alanko, Anita (Department: 1713)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S041000, C216S046000, C216S049000, C216S051000, C216S067000, C216S074000, C216S079000
Reexamination Certificate
active
08043518
ABSTRACT:
The method of manufacturing a nozzle plate which includes a nozzle having a tapered section and a linear section includes the steps of: forming an etching stopper layer for stopping dry etching of a silicon substrate, on a first surface of the silicon substrate; forming a mask layer on a second surface of the silicon substrate reverse to the first surface; performing a first patterning process with respect to the mask layer so that an opening section is formed in the mask layer; carrying out the dry etching of the silicon substrate through the opening section in the mask layer so that the tapered section of the nozzle is formed in the silicon substrate; carrying out dry etching of the etching stopper layer through the opening section in the mask layer so that at least a part of the linear section of the nozzle is formed in the etching stopper layer; and removing the mask layer.
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Alanko Anita
Birch & Stewart Kolasch & Birch, LLP
Fujifilm Corporation
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