Method of manufacturing nozzle plate, liquid ejection head...

Etching a substrate: processes – Forming or treating thermal ink jet article

Reexamination Certificate

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Details

C216S041000, C216S046000, C216S049000, C216S051000, C216S067000, C216S074000, C216S079000

Reexamination Certificate

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08043518

ABSTRACT:
The method of manufacturing a nozzle plate which includes a nozzle having a tapered section and a linear section includes the steps of: forming an etching stopper layer for stopping dry etching of a silicon substrate, on a first surface of the silicon substrate; forming a mask layer on a second surface of the silicon substrate reverse to the first surface; performing a first patterning process with respect to the mask layer so that an opening section is formed in the mask layer; carrying out the dry etching of the silicon substrate through the opening section in the mask layer so that the tapered section of the nozzle is formed in the silicon substrate; carrying out dry etching of the etching stopper layer through the opening section in the mask layer so that at least a part of the linear section of the nozzle is formed in the etching stopper layer; and removing the mask layer.

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patent: 2001-30500 (2001-02-01), None

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