Etching a substrate: processes – Gas phase and nongaseous phase etching on the same substrate
Reexamination Certificate
2006-06-06
2006-06-06
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Gas phase and nongaseous phase etching on the same substrate
C216S041000, C216S051000, C216S066000, C216S094000, C430S296000, C430S313000, C204S192100, C250S492300, C977S722000
Reexamination Certificate
active
07056446
ABSTRACT:
A method of easily manufacturing a nano-gap electrode by using a focused ion beam lithography includes a layer depositing step of depositing an electrode layer and a metal mask layer in this order on an insulating substrate, a mask pattern forming step of etching the metal mask layer by using the focused ion beam and thereby forming a mask pattern, a dry etching step of transferring a pattern to the electrode layer by dry etching, and a wet etching step of removing the metal mask layer by using a solution that selectively dissolves the metal mask layer compared to the electrode layer.
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Kubota Tohru
Mashiko Shinro
Nagase Takashi
Ahmed Shamim
Communications Research Laboratory, Independent Administrative I
Foley & Lardner LLP
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