Method of manufacturing multilayered printed-wiring-board

Metal working – Method of mechanical manufacture – Electrical device making

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29840, 174259, 361408, 361412, H05K 336

Patent

active

050313088

ABSTRACT:
A method of manufacturing a mutilayered printed-wiring-board comprises attaching conductive members on conductive layers, superimposing a plurality of printed-wiring boards, and electrically connecting the conductive layers with one another by the conductive members.

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patent: 3646670 (1972-03-01), Maeda et al.
patent: 3780352 (1973-12-01), Redwanz
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 3835531 (1974-09-01), Luttmer
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patent: 4692843 (1987-09-01), Matsumoto et al.
patent: 4788766 (1988-12-01), Burger et al.
patent: 4818728 (1989-04-01), Rai et al.
IBM Tech. Discl. Bull., vol. 21, No. 12, May 1979, pp. 4796-4796, by Abolafia et al.

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