Method of manufacturing multilayered ceramic substrate

Details Method of manufacturing multilayered ceramic substrate Method of manufacturing multilayered ceramic substrate

1996-07-17

1998-09-29

Marquis, Melvyn I.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

428446, 156 8911, 338307, 338308, 338314, B05D 512

Patent

active

058143661

ABSTRACT:
In a method of manufacturing a multilayered ceramic substrate, a capacitor layer is formed on a green sheet of a low temperature co-firable ceramic by means of printing. The green sheet with the capacitor layer and a plurality of other green sheets are laminated together into a substrate laminate. Two release green sheets of alumina system each unsintered below 1,000.degree. C. are further laminated to the top and the bottom of the substrate laminate respectively. The obtained laminate is fired at a temperature ranging between 800.degree. and 1,000.degree. C. under pressure ranging between 2 and 20 kgf/cm.sup.2. The release green sheets adherent to the side surfaces of the substrate are removed after the firing. Subsequently, a wiring pattern is printed on the substrate, which is then fired at a temperature ranging between 800.degree. and 1,000.degree. C.

Affiliated with

Also associated with

Rating

Method of manufacturing multilayered ceramic substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing multilayered ceramic substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing multilayered ceramic substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-684440