Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-02-22
2008-09-09
Nguyen, Donghai D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S831000, C029S832000, C029S852000, C174S259000, C156S247000, C438S624000
Reexamination Certificate
active
07421777
ABSTRACT:
The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.
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Asami Hiroshi
Kusano Hidetoshi
Nishitani Yuki
Orui Ken
Depke Robert J.
Nguyen Donghai D.
Rockey Depke & Lyons, LLC
Sony Corporation
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