Method of manufacturing multilayer wiring board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S830000, C029S832000, C174S262000, C174S263000, C174S264000, C174S265000, C174S266000, C264S261000, C264S272150, C264S272170

Reexamination Certificate

active

07624501

ABSTRACT:
First, a plurality of wiring boards are fabricated at separate steps. The first wiring board includes a Cu post formed on a wiring layer on one surface of a substrate, and a first stopper layer formed at a desired position around the Cu post. The second wiring board includes a through hole for insertion of the Cu post therethrough, a connection terminal formed on a wiring layer on one surface of a substrate, and a second stopper layer that engages the first stopper layer and functions to suppress in-plane misalignment. The third wiring board includes a connection terminal formed on a wiring layer on one surface of a substrate. Then, the wiring boards are stacked up, as aligned with one another so that the wiring layers are interconnected via the Cu post and the connection terminals, to thereby electrically connect the wiring boards. Thereafter, resin is filled into gaps between the wiring boards.

REFERENCES:
patent: 5628852 (1997-05-01), Ishida
patent: 2002/0179331 (2002-12-01), Brodsky et al.
patent: 2006/0137905 (2006-06-01), Kariya et al.
patent: 2008/0168652 (2008-07-01), Koyama et al.
patent: 2004-47816 (2004-02-01), None

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