Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-02-05
2009-12-01
Banks, Derris H (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S832000, C174S262000, C174S263000, C174S264000, C174S265000, C174S266000, C264S261000, C264S272150, C264S272170
Reexamination Certificate
active
07624501
ABSTRACT:
First, a plurality of wiring boards are fabricated at separate steps. The first wiring board includes a Cu post formed on a wiring layer on one surface of a substrate, and a first stopper layer formed at a desired position around the Cu post. The second wiring board includes a through hole for insertion of the Cu post therethrough, a connection terminal formed on a wiring layer on one surface of a substrate, and a second stopper layer that engages the first stopper layer and functions to suppress in-plane misalignment. The third wiring board includes a connection terminal formed on a wiring layer on one surface of a substrate. Then, the wiring boards are stacked up, as aligned with one another so that the wiring layers are interconnected via the Cu post and the connection terminals, to thereby electrically connect the wiring boards. Thereafter, resin is filled into gaps between the wiring boards.
REFERENCES:
patent: 5628852 (1997-05-01), Ishida
patent: 2002/0179331 (2002-12-01), Brodsky et al.
patent: 2006/0137905 (2006-06-01), Kariya et al.
patent: 2008/0168652 (2008-07-01), Koyama et al.
patent: 2004-47816 (2004-02-01), None
Banks Derris H
Carley Jeffrey
Kratz Quintos & Hanson, LLP
Shinko Electric Industries Co. Ltd.
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